Syensqo introduces Kalix® LD-4850, a next-generation low-density structural polymer for consumer electronics

New high-performance polymer cuts component weight by over 30% while maintaining strength and premium aesthetics


#Syensqo, a global leader in advanced materials and specialty chemicals, announces the launch of Kalix® LD-4850 BK000, a new low-density #highperformancepolyamide (HPPA) developed to address the evolving demands of the consumer electronics industry. 


#Kalix® LD-4850 enables manufacturers to achieve substantial lightweighting of structural components in devices such as smartphones, AR/VR headsets, and other smart #electronics. The new grade delivers over 30% weight reduction compared to conventional structural #polyamides and polycarbonates, while maintaining excellent mechanical strength and premium surface #aesthetics


Engineered for applications where reduced weight is essential, such as brackets, frames, speaker housings, and AR/VR glass legs, Kalix® LD-4850 combines high stiffness and strength with minimal warpage and low dielectric properties. This unique balance supports the development of slimmer, lighter, and more comfortable devices, in line with current hardware trends. 


source : Syensqo


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