𝗔𝘀𝗮𝗵𝗶 𝗞𝗮𝘀𝗲𝗶 𝗗𝗲𝘃𝗲𝗹𝗼𝗽𝘀 𝗡𝗼𝘃𝗲𝗹 𝗣𝗵𝗼𝘁𝗼𝘀𝗲𝗻𝘀𝗶𝘁𝗶𝘃𝗲 𝗣𝗼𝗹𝘆𝗶𝗺𝗶𝗱𝗲 𝗙𝗶𝗹𝗺 𝗳𝗼𝗿 𝗔𝗱𝘃𝗮𝗻𝗰𝗲𝗱 𝗣𝗮𝗻𝗲𝗹-𝗟𝗲𝘃𝗲𝗹 𝗦𝗲𝗺𝗶𝗰𝗼𝗻𝗱𝘂𝗰𝘁𝗼𝗿 𝗣𝗮𝗰𝗸𝗮𝗴𝗶𝗻𝗴
Panel-level packaging has gained momentum in the semiconductor industry as manufacturers pursue higher efficiency and improved yield that can support next-generation packaging processes. In response to these market changes, Asahi Kasei, a diversified global company, has combined the features of its photosensitive #polyimide (PSPI) and dry film photoresist (DFR) into a new #photosensitive film. The PSPI film is currently under customer evaluation, with commercial availability expected in the near future. The new PSPI film was developed by combining Asahi Kasei’s expertise in the manufacture of PIMEL™ liquid PSPI used for buffer coatings and passivation layers and SUNFORT™ dry film photoresist for temporary #lithographiccircuit patterning on substrates and wafers. It will improve productivity in semiconductor packaging manufacturing by enabling easy, uniform application of a lamination process to large square panels. In addition, the film is designed to accommodate an increased number...