Celanese 𝐙𝐞𝐧𝐢𝐭𝐞 𝐋𝐂𝐏𝟓𝟐𝟒𝟓𝐋

New for manufacturers of thin-wall electrical components: Zenite® LCP 5245L, a high-flow, low warp solution to enable reliable high-volume production of these sensitive components.  

Molders of complex CPU sockets for AI server platforms already are benefitting from the attributes of this new material. Are you manufacturing:

• Applications with high-pin density designs?

• Large components with tight warpage requirements?

• Applications sensitive to surface defects or post-processing damage?

• High-volume thin-walled parts (and maybe having challenges with process simplification and robustness)?


Then you really should make time to learn about Zenite® LCP 5245L. 

And it is easy to learn more with the help of the Chemille digital assistant. The TDS and processing datasheet are available immediately, and registering at Chemille will open access to other documents such as CAE, regulatory and other documents.


source : Celanese


It’s all available right here: https://lnkd.in/eS4ZVckE

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