𝗛𝗶𝗴𝗵 𝗧𝗵𝗲𝗿𝗺𝗮𝗹 𝗥𝗲𝘀𝗶𝘀𝘁𝗮𝗻𝘁, 𝗮𝗻𝗱 𝗟𝗼𝘄-𝗥𝗲𝘀𝗶𝗱𝘂𝗮𝗹 𝗦𝘁𝗿𝗲𝘀𝘀 𝗣𝗵𝗼𝘁𝗼-𝗱𝗲𝗳𝗶𝗻𝗮𝗯𝗹𝗲 𝗣𝗼𝗹𝘆𝗶𝗺𝗶𝗱𝗲 𝗦𝗲𝗮𝗹𝗶𝗻𝗴 𝗠𝗮𝘁𝗲𝗿𝗶𝗮𝗹－𝗖𝗼𝗻𝘁𝗿𝗶𝗯𝘂𝘁𝗶𝗻𝗴 𝘁𝗼 𝗜𝗺𝗽𝗿𝗼𝘃𝗲𝗱 𝗥𝗲𝗹𝗶𝗮𝗯𝗶𝗹𝗶𝘁𝘆 𝗮𝗻𝗱 𝗠𝗶𝗻𝗶𝗮𝘁𝘂𝗿𝗶𝘇𝗮𝘁𝗶𝗼𝗻 𝗼𝗳 𝗠𝗘𝗠𝗦 𝗗𝗲𝘃𝗶𝗰𝗲

Toray Industries announced today that it has developed a photo-definable polyimide sealing material for #microelectromechanicalsystems (MEMS) devices, which integrate electronic circuits and mechanical structures using #semiconductor microfabrication technology. The new material is based on the company’s #SEMICOFINE® non-photo-definable #polyimide and #PHOTONEECE® photo-definable polyimide, used to insulate semiconductors and displays.

Toray’s new material enables integrated fine-pattern formation and bonding with photolithography, and would provide sealing for hollow structure fabrication for MEMS devices.

These devices use hollow structures so parts can move freely or serve as voids to block external disturbances. Gold is a traditional #sealing material for these structures because it provides excellent sealing and thermal resistance. A need to cut material costs and improve design flexibility, however, is driving research into resin-based sealing technologies. Epoxy resin does offer some potential as it is a common encapsulant. But its thermal resistance and mechanical strength are inadequate, and thermal changes render it prone to deformation and stress.

Toray overcame these challenges with its new sealing material. This combines high thermal resistance and low residual stress by optimizing the molecular and photo-definable properties of polyimide. As well as offering polyimide’s inherent high insulation and thermal resistance, a low residual stress design suppresses warping from thermal histories to deliver far greater long-term device reliability than conventional resins.

Another benefit of this material is its high mechanical strength, enabling narrower lines at bonding interfaces to increase device density . The material is free of polyfluoroalkyl substances: PFAS and N-methyl-2-pyrrolidone: NMP, catering to rising demand for environmentally and safety-conscious material specifications.

#Toray plans to deliver a presentation on this material at the 2026 International Conference on Electronics Packaging and Hybrid Bonding Symposium (ICEP-HBS 2026) from April 14 through 18.

The company looks to add its new material to its range of resins for semiconductor devices and electronic components. It will push forward with prototyping and provide samples to MEMS customers. Key milestones are to secure material certification in 2027 and begin mass production in 2029.

source :Toray